Method for manufacturing printed circuit board with thick traces
US8377317B2 · kind B2 · utility
1Cited by
1References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 10, 2010 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Mar 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first surface is provided. A number of first traces directly formed on the second surface. A first insulating layer is formed on the second surface of the first electrically conductive layer and the surface of the first traces. The electrically conductive layer is etched to form a number of second traces, the second traces superpose the first traces, the first traces and the second traces constitute a circuit pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.