Etchant for metal wiring and method for manufacturing metal wiring using the same
US8377325B2 · kind B2 · utility
2Cited by
0References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2011 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Sep 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/441
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Exemplary embodiments of the present invention provide a metal wiring etchant. A metal wiring etchant according to an exemplary embodiment of the present invention includes ammonium persulfate, an organic acid, an ammonium salt, a fluorine-containing compound, a glycol-based compound, and an azole-based compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.