Flip chip package containing novel underfill materials
US8377550B2 · kind B2 · utility
2Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2009 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Mar 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and associated structures of forming underfill material are described. Those methods may include applying an underfill to an interconnect structure comprising residue from a no clean flux, wherein the underfill comprises at least one of a functionalized nanofiller and a micron-sized filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.