Thermally imageable dielectric layers, thermal transfer donors and receivers

US8377622B2 · kind B2 · utility

Assignee

• E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

• Gerald Donald Andrews · Hockessin, US
• Richard Kevin Bailey · Newark, US
• Graciela Beatriz Blanchet · Boston, US
• Reid John Chesterfield · Lompoc, US
• Feng Gao · Beijing, CN
• Marc B. Goldfinger · West Chester, US
• Gary Delmar Jaycox · West Chester, US
• Lynda Kaye Johnson · Wilmington, US
• William J. Marshall · Wilmington, US
• Elizabeth Forrester McCord · Hockessin, US
• Charles Nehemiah McEwen · Newark, US
• Jeffrey Scott Meth · Landenberg, US
• Geoffrey Nunes · Swarthmore, US
• Kenneth George Sharp · Landenberg, US

Key dates

• Filing date: Sep 22, 2011
• Grant date: Feb 19, 2013
• Expiry date: Sep 22, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31928
• WIPO field: Textile and paper machines
• WIPO sector: Mechanical engineering

Abstract

The invention is related to thermal imageable dielectric layers and thermal transfer donors and receivers comprising dielectric layers. The thermal transfer donors are useful in making electronic devices by thermal transfer of dielectric layers having excellent resistivity, good transfer properties and good adhesion to a variety of receivers.