Radiation sensitive silicone resin composition
US8377634B2 · kind B2 · utility
3Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2005 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | May 15, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D183/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to acrylic functional resin compositions. More particularly, this invention relates to Poly [organ-co-(meth)acryloxyorgano]silsequioxane resins that are curable upon exposure to ultraviolet radiation with photo initiator or upon heating with or without a free radical generator. The resin compositions have high storage stability at room temperature and produces films that are useful as planarization layer, interlayer dielectric, passivation layer, gas permeable layer, negative photoresist, antireflective coating, conformal coating and IC packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.