Optical-semiconductor device and method for manufacturing the same
US8377725B2 · kind B2 · utility
8Cited by
0References
12Claims
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Key dates
| Filing date | Sep 8, 2009 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Sep 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8514
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.