Semiconductor device and method of manufacturing the same
US8377752B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2011 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Jun 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In regard to a semiconductor device having a multilayered wiring board where a semiconductor chip is embedded inside, a technology which allows the multilayered wiring board to be made thinner is provided. A feature of the present invention is that, in a semiconductor device where bump electrodes are formed over a main surface (element forming surface) of a semiconductor chip embedded in a chip-embedded wiring board, an insulating film is formed over a back surface (a surface on the side opposite to the main surface) of the semiconductor chip. As a result, it becomes unnecessary to form a prepreg over the back surface of the semiconductor chip. Therefore, an effect of thinning the chip-embedded wiring board in which the semiconductor chip is embedded is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.