Method for bonding of semiconductor component to a substrate
US8377797B1 · kind B1 · utility
1Cited by
7References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2010 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Dec 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/024
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of attaching a semiconductor component to a heat-sink where the component is first placed onto a heat-sink substrate whose attachment surface comprises a malleable-metal film, a semiconductor component is placed onto the malleable-metal film, and pressure and heat is applied for a predetermined time to the stack including substrate with malleable-metal film and semiconductor component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.