Patent · US Active

LED package

US8378347B2 · kind B2 · utility

10Cited by

0References

20Claims

0Family size

Assignee

Kabushiki Kaisha Toshiba · JP

Inventors

Satoshi Shimizu · Tokyo, JP
Kazuhisa Iwashita · Kitakyushu, JP
Teruo Takeguchi · Itoshima, JP
Tetsuro Komatsu · Yokohama, JP
Hiroaki Oshio · Yokohama, JP
Tatsuo Tonedachi · Kitakyushu, JP
Naoya Ushiyama · Itoshima, JP
Kazuhiro Inoue · Itoshima, JP
Gen Watari · Itoshima, JP

Key dates

Filing date	Nov 4, 2011
Grant date	Feb 19, 2013
Priority date	—
Expiry date	Nov 4, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8506
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.