Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate
US8378507B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2009 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Apr 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate and a semiconductor chip mounted on the wiring substrate are connected together via a bonding wire. The distance from each end of the semiconductor chip to a wire bond pad provided on the wiring substrate is smaller than the height of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.