Thermal transfer and acoustic matching layers for ultrasound transducer
US8378557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2011 |
| Grant date | Feb 19, 2013 |
| Priority date | — |
| Expiry date | Sep 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Ultrasound transducers and methods of making ultrasound transducers with improved thermal characteristics are provided. An ultrasound transducer includes a piezoelectric element defining a front side and a back side. The ultrasound transducer includes a lens connected to the front side of the piezoelectric element, a heat sink connected to the back side of the piezoelectric element, and a backside matching layer disposed between the piezoelectric element and the heat sink. The backside matching layer is thermally connected to the piezoelectric element and the heat sink, and the backside matching layer is configured to conduct heat from the piezoelectric element to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.