Method of manufacturing a boundary acoustic wave device
US8381386B2 · kind B2 · utility
4Cited by
3References
2Claims
0Family size
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Inventor
Key dates
| Filing date | Dec 23, 2008 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Dec 23, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.