Patch on interposer through PGA interconnect structures
US8381393B2 · kind B2 · utility
0Cited by
5References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2009 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Apr 26, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.