System and method for floor covering installation
US8381473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2008 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jan 10, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2857
- WIPO fieldFurniture, games
- WIPO sectorOther fields
Abstract
Connectors for joining adjacent modular floor covering units. The connectors include a film and an adhesive layer coated on one side of the film. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. Tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on a underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the underlying floor surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.