Patent · US Active

Chemical mechanical planarization pad conditioner and methods of forming thereof

US8382557B2 · kind B2 · utility

0Cited by

9References

20Claims

0Family size

Assignees

SAINT-GOBAIN ABRASIVES, INC. · US
SAINT-GOBAIN ABRASIFS · FR

Inventors

Jianhui Wu · Chengdu, CN
Richard W. J. Hall · Southborough, US

Key dates

Filing date	Oct 23, 2008
Grant date	Feb 26, 2013
Priority date	—
Expiry date	Dec 6, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24D18/00
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A CMP pad conditioner is provided that includes a substrate having a surface and three dimensional structures protruding relative to the surface of the substrate. The three dimensional structures include CVD carbon-containing material selected from the group consisting of carbon nanotubes and diamond, and may be arranged in a ordered array or desired pattern. The CMP pad conditioner also includes a bonding layer overlying the three dimensional structures and the surface of the substrate. The condition may include a reinforcing layer disposed within gaps between the three dimensional structures. Techniques for manufacture and use are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.