Metallization process for making fuser members
US8382970B2 · kind B2 · utility
2Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2008 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jan 6, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/773
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.