Method of forming thin film
US8383211B2 · kind B2 · utility
1Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2008 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Mar 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24488
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a thin film includes: forming a thin film on a substrate by discharging liquid material as a droplet; discharging the liquid material to a liquid material disposing-region that is wider than a thin film forming region; and drying the liquid material thereby to dispose a raising portion at the edge of the thin film in the outside of the thin film forming region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.