Pattern exposure method, conductive film producing method, and conductive film
US8383329B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2010 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Apr 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24997
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200 μm, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to 1/6 of the designed width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.