Method for manufacturing a micromachined device and the micromachined device made thereof
US8383441B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 21, 2011 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Apr 1, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00698
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods for manufacturing micromachined devices and the devices obtained are disclosed. In one embodiment, the method comprises providing a structural layer comprising an amorphous semiconductor material, forming a shielding layer on a first portion of the structural layer and leaving exposed a second portion of the structural layer, and annealing the second portion using a first fluence. The method further comprises removing the shielding layer, and annealing the first portion and the second portion using a second fluence that is less than half the first fluence. In an embodiment, the device comprises a substrate layer, an underlying layer formed on the substrate layer, and a sacrificial layer formed on only a portion of the underlying layer. The device further comprises a structural layer that is in contact with the underlying layer and comprises a first region annealed using a first fluence and a second region annealed using a second fluence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.