Substrate cutting apparatus and method of cutting substrate using the same
US8383983B2 · kind B2 · utility
8Cited by
19References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2010 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jan 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/851
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.