Electrostatic bonding of a die substrate to a package substrate
US8384269B2 · kind B2 · utility
1Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2010 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jan 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1014
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A transducer apparatus comprises a package substrate and a transducer disposed over a die substrate. The die substrate is disposed over the package substrate. The transducer apparatus also comprises a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.