Integrated enclosure/touch screen assembly
US8384674B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2001 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jul 18, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated enclosure/touch screen assembly with a soft thermoplastic outer surface coupled directly to a digitizer mechanism. A touch screen assembly consisting of a display mechanism and a resistive digitizer mechanism are enclosed within a single piece cover. The digitizer mechanism consists of a top film and a digitizing element, and the single piece cover is affixed directly to the top film of the digitizer mechanism. The single piece cover has a flat outer surface that is free of any steps or indentations which provides an enclosure that is both dust free and waterproof. The soft thermoplastic material used for the single piece cover will allow activation of the digitizer mechanism by means of mechanical pressure applied to the outer surface of the single piece cover. In one embodiment, the single piece cover is constructed by coupling a soft thermoplastic outer film directly to the top film of the digitizer mechanism by an in mold decoration process. This process forms the flat outer surface for the single piece cover and also may be used to provide various shapes for the outer edges of the cover. In a second embodiment, a touch screen assembly consisting of a display mech…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.