In-line memory and circuit board cooling system
US8385067B2 · kind B2 · utility
14Cited by
12References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2010 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jul 30, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.