Liquid coolant conduit secured in an unused socket for memory module cooling
US8385069B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2010 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Aug 11, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.