Flexible data strobe signal bus structure for wirebond and flip-chip packaging
US8385142B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2009 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jun 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit with a flexible data strobe signal (DQS) bus structure is presented. The integrated circuit has a number of input/output (I/O) modules with a number of data pins to receive and transmit data. In addition, a subset of the I/O modules also have a data strobe pin. The input/output modules are connected to data strobe signal buses having a fixed configuration. The configuration of the fixed DQS bus groups a number of data pins with a corresponding data strobe pin and the grouping of data pin spans multiple I/O modules. The integrated circuit also has a flexible data bus connected to the I/O modules. Data pins of I/O modules of a second integrated circuit are mapped a subset of the data pins of corresponding I/O modules of the integrated circuit. The flexible data strobe signal bus enables selection of the subset of data pins in the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.