Patent · US Active

Complex connector in component footprint of implantable medical device

US8386044B2 · kind B2 · utility

1Cited by

31References

9Claims

0Family size

Assignee

Medtronic, Inc. · US

Inventors

Angela Rodgers · Minneapolis, US
Andrew J. Ries · Lino Lakes, US
Kurt J. Casby · Elbow Lake, US
John D. Norton · New Brighton, US
Mark D. Breyen · Plymouth, US
Dan D. Erklouts · Brooklyn Center, US
Brian Ross · Maple Grove, US
Timothy T. Bomstad · Inver Grove Heights, US
Wayne L. Appleseth · Lino Lakes, US
Michael Clarke · Bedford, US
Jeffrey L. Kehn · Chaska, US
Scott J. Robinson · Forest Lake, US

Key dates

Filing date	Nov 30, 2005
Grant date	Feb 26, 2013
Priority date	—
Expiry date	May 12, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01R2201/12
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.