Determining bond surface condition in composite structures
US8386194B1 · kind B1 · utility
3Cited by
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20Claims
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Key dates
| Filing date | Jun 24, 2010 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Mar 15, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2013/0208
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The condition of a bond surface is determined. A 3-D wettability tension curve is generated for the bond surface which represents a range of possible wettings of an adhesive on the bond surface that may result in a bond joint of acceptable quality. At least three surface energies on the bond surface are measured, and the wettability curve is used to determine whether the condition of the bond surface is acceptable based on the measured bonding surface energies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.