On-chip networks for flexible three-dimensional chip integration
US8386690B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2009 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jul 30, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F15/7842
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Mechanisms for providing an interconnect layer of a three-dimensional integrated circuit device having multiple independent and cooperative on-chip networks are provided. With regard to an apparatus implementing the interconnect layer, such an apparatus comprises a first integrated circuit layer comprising one or more first functional units and an interconnect layer coupled to the first integrated circuit layer. The first integrated circuit layer and interconnect layer are integrated with one another into a single three-dimensional integrated circuit. The interconnect layer comprises a plurality of independent on-chip communication networks that are independently operable and independently able to be powered on and off, each on-chip communication network comprising a plurality of point-to-point communication links coupled together by a plurality of connection points. The one or more first functional units are coupled to a first independent on-chip communication network of the interconnect layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.