Components with re-entrant shaped cooling channels and methods of manufacture
US8387245B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2010 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jun 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49341
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of fabricating a component is provided. The method includes forming one or more grooves in a surface of a substrate, where the substrate has at least one hollow interior space. Each of the one or more grooves extends at least partially along the substrate surface and has a base and a top. The base is wider than the top, such that each of the one or more grooves comprises a re-entrant shaped groove. The method further includes forming one or more access holes through the base of a respective groove, to connect the groove in fluid communication with respective ones of the hollow interior space(s), and disposing a coating over at least a portion of the substrate surface. The one or more grooves and coating define one or more re-entrant shaped channels for cooling the component. A component with one or more re-entrant shaped channels and a method of coating a component are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.