Method for embedding heat pipe into heat-conducting seat
US8387250B2 · kind B2 · utility
1Cited by
24References
4Claims
0Family size
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Inventors
Key dates
| Filing date | Nov 4, 2008 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jun 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53122
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.