Wafer container with purgeable supporting module
US8387799B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2011 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jul 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67393
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each sidewall to of the container body and the back wall, a long slit is further disposed on the side of purgeable supporting module facing the opening and a porous material is disposed within the long slit, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to a gas valve, wherein the purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.