Internal chamfering device and method
US8388277B2 · kind B2 · utility
3Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2008 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jan 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T408/8738
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming an opening in a layered structure includes providing a layered structure including a first layer and a second layer and a near-zero gap interface defined between the first layer and the second layer; providing an opening through the layered structure such that the opening extends through the first layer and the second layer; and working simultaneously the opening in the fay surface of the first layer and the opening in the fay surface of the second layer without separating the first layer and the second layer. An internal chamfering device is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.