Substrate structures applied in flexible electrical devices and fabrication method thereof
US8388779B2 · kind B2 · utility
3Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2012 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Apr 17, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The disclosure also provides a method for fabricating the substrate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.