Ultrahydrophobic substrates
US8389114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2011 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jun 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a process for modification of a substrate so as to form an ultrahydrophobic surface on the substrate. Also disclosed are surface-modified substrates that can be formed according to the disclosed processes. The process includes attachment of a multitude of nano- and/or submicron-sized structures to a surface to provide increased surface roughness. In addition, the process includes grafting a hydrophobic material to the surface in order to decrease the surface energy and decrease wettability of the surface. The combination of increase surface roughness and decreased surface energy can provide an ultrahydrophobic surface on the treated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.