Inkjet ink composition
US8389601B2 · kind B2 · utility
1Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2009 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jun 22, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.