Laminating adhesive for demoulding at elevated temperature
US8389647B2 · kind B2 · utility
7Cited by
1References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2009 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Feb 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a laminating adhesive composition, which contains a reaction product which contains isocyanate groups and which is obtained from the reaction of at least two specific polyester polyols, solid at room temperature, and a polyisocyanate. Particularly in the case of three-dimensionally deformed support material surfaces, the laminating adhesive compositions permit removal from the laminating mold at an elevated temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.