Metal trace fabrication for optical element
US8389851B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 21, 2010 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jun 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.