Patent · US Active

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

US8389868B2 · kind B2 · utility

3Cited by

4References

30Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Dirk Robert Walter Leipold · San Jose, US
Chih-Ming Hung · McKinney, US
David Wayne Evans · Allen, US

Key dates

Filing date	Dec 31, 2007
Grant date	Mar 5, 2013
Priority date	—
Expiry date	Nov 21, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.