Electrothermal focussing for the production of micro-structured substrates
US8389903B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 7, 2008 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Aug 13, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB26F1/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in microfluidic and analysis devices and provides a method of introducing a structure, preferably a hole or cavity or channel or well or recess, in a region of an electrically insulating substrate (s), said method comprising the steps: a) providing an electrically insulating substrate (s), b) storing electrical energy across said substrate using an energy storage element (c) which is charged with said electrical energy, said energy storage element being electrically connected to said substrate, said electrical energy being sufficient to significantly heat, and/or melt and/or evaporate parts or all of a region of said substrate, c) applying additional energy, preferably heat, to said substrate or a region thereof to increase the electrical conductivity of said substrate or said region thereof, and thereby initiate a current flow and, subsequently, a dissipation of said stored electrical energy within the substrate and d) dissipating said stored electrical energy, wherein the rate of dissipating said stored electrical e…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.