Electronic element wafer module with reduced warping
US8390003B2 · kind B2 · utility
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2References
31Claims
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Assignee
Inventors
Key dates
| Filing date | May 29, 2009 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | May 17, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
Abstract
An electronic element wafer module according to the present invention is provided, in which a translucent support substrate for covering and protecting a plurality of electronic elements is attached on an electronic element wafer having the plurality of electronic elements formed thereon, and an optical filter is formed corresponding to the electronic elements on at least one surface of the translucent support substrate, where the optical filter is removed to lessen warping along a part or all of dicing lines for individually dividing the electronic element wafer module into a plurality of electronic element modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.