Chip card, and method for the production thereof
US8390132B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 18, 2012 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jan 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A chip card in the form of an ID-1 card, a plug-in SIM or a USB token has a layered compound (12) with two (4, 5) or three (4, 5, 9) layers extending over the complete chip card (1). An exterior foil layer (4) has on its outward facing front side (4a) a communication contact layout (2) and on its back side (4b) a flip chip (7), as well as a flip chip contact layout (6) which is electroconductively connected with the communication contact layout (2) on the front side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.