Connections for ultrasound transducers
US8390174B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2007 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jan 2, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Described herein are electrical connections to acoustic elements, e.g., piezoelectric elements. In an exemplary embodiment, a transducer comprises an acoustic element, a passive layer attached to the acoustic element, and a conductive post embedded in the passive layer to provide a direct low resistance electrical connection to the acoustic element. In one embodiment, the conductive post has an exposed side surface allowing electrical connections to be made from the side of the transducer. In another embodiment, the conductive post has an exposed bottom surface allowing electrical connections to be made from the bottom of the transducer. In another embodiment, the transducer comprises an extension substrate adjacent to the acoustic element for protecting the acoustic element from thermal stress when a connection is made to the transducer at high temperatures. In one embodiment, a circuit is integrated on the extension substrate to process signals to or from the acoustic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.