Apparatuses and methods for removal of ink buildup
US8393707B2 · kind B2 · utility
18Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2010 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | May 18, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1721
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A substrate patterning method including the steps of spraying ink on a surface of a substrate, the spraying of the ink resulting in an overspray of excess ink past an edge of the substrate; changing a temperature of the excess ink to cause a change in a viscosity of the excess ink; and removing the excess ink having the changed viscosity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.