Arrangement with a semiconductor chip and an optical waveguide layer
US8393748B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2008 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Jan 10, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/0076
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.