Patent · US Active

Formulations for environmentally friendly photoresist film layers

US8394575B2 · kind B2 · utility

5Cited by

2References

11Claims

0Family size

Assignee

Lexmark International, Inc. · US

Inventors

Xiaoming Wu · Jinan, CN
David C. Graham · Lexington, US
Sean T. Weaver · Florence, US
Bart Mansdorf · Lexington, US
Rich Wells · Delaware, US
Joel Provence · Delaware, US

Key dates

Filing date	Sep 30, 2010
Grant date	Mar 12, 2013
Priority date	—
Expiry date	Mar 14, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/0045
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.