Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture
US8394679B2 · kind B2 · utility
4Cited by
4References
10Claims
0Family size
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Key dates
| Filing date | Sep 1, 2010 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Sep 1, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/166
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method for cold weld compression bonding using a metallic nano-structured gasket is provided. This structure and method allows a hermetic package to be formed at lower pressures and temperatures than are possible using bulk or conventional thin-film gasket materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.