Composite woven fabric and printed wiring board
US8394731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2007 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Apr 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3976
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.