High-temperature superconductive layer arrangement

US8394741B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Michael Baecker · Cologne, DE
• Oliver Brunkahl · Remagen, DE
• Martina Falter · Rheinbach, DE

Key dates

• Filing date: Mar 14, 2009
• Grant date: Mar 12, 2013
• Expiry date: Mar 14, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31678

Abstract

A high-temperature superconductor layer arrangement includes at least one substrate and one textured buffer layer made of oxidic material. The buffer layer displays at least one further constituent forming a homogeneous mixed-crystal layer. The further constituent is a transition metal from the first subgroup and/or forming at least a partial melt with the oxidic buffer material at an annealing temperature of ≦1,600 degrees Celsius. The further constituent can particularly be copper and/or silver.