Inductor structures for integrated circuit devices
US8395233B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2009 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Aug 26, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An IC device (100) includes an IC body (106) having a base layer (108) and first and second upper layers (114, 116) on the base layer. The IC body includes a cavity region (104) extending through said base and first upper layers and at least a portion of said second upper layer. In the IC device, a portion of said second upper layer in the cavity region comprises a planar inductive element (102) having first and second contacting ends (140, 142). In the IC device, at least one support member (128, 130, 132) extends at least partially into said cavity region from said IC body in at least a first direction parallel to said base layer and intersects at least a portion of said planar inductive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.