Packaging for low-cost, high-performance microwave and millimeter wave modules
US8395256B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2007 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Sep 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Microwave or millimeter wave system packaging having a system with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.